XI'AN ESWIIN Material Technology Co., Ltd. is located in Xi'an High-tech Development Zone. It is mainly engaged in the R&D, manufacturing and sales of 12-inch integrated circuit silicon single crystal polished wafers and epitaxial wafers. The products are suitable for logic chips (Logic), flash memory chips (3D NAND & Nor Flash), dynamic random access memory (DRAM), image sensor (CIS), display driver IC (Display Driver IC) and other fields.

The company has mastered hundreds of core patented technologies and mature mass production capabilities in the fields of silicon wafer technology research, manufacturing process research, etc., adopts leading technology and measurement equipment, and conducts high-standard quality control over the entire production process (passed ISO 9001, IATF 16949 , QC080000 and other management system certifications), have reached the international advanced level in terms of single crystal quality, geometric shape, particle and pollution control, etc., and are committed to providing global customers with better quality 12-inch large silicon wafer products and professional services.

Polished wafers are silicon wafer product with a mirror-like surface obtained by cutting a single crystal silicon rod with a diameter of 300mm and a crystal orientation of <100> into thin slices, and after grinding, polishing, cleaning and other processes. According to different types of dopants, polishing sheets can be divided into P-type and N-type